Chipsbank Microelectronics Co., Ltd. is a fabless IC design company targeting at the applications in the areas such as digital audio/video processing, mobile storage, network communications, consumer electronics, etc. Chipsbank also provides system solutions for its chips and provides design services to customers.

Chipsbank Microelectronics Co., Ltd. was established in February, 2003, by senior designers who were back to China from USA or Europe. The core team members all have advanced degrees from renowned universities in China, USA, or Europe and have many years of first hand design experiences in famous IC design companies such as Broadcom, Western Digital, Lucent and Philips, etc., including low power high speed digital design, high performance DSP design, multi-million gate IC design with leading-edge 0.13 micron CMOS process technology.

Chipsbank distinguishes itself from many other IC design companies by a state-of-the-art IC design process and modern management strategy. Chipsbank has a plenty of proprietary intellectual property (IP) which will benefit both its IC design and its customers. Chipsbank has been combining all its advantages to provide IC chips with high stability, high performance and low cost, and thus to make Chipsbank a reliable global brand name.

In view of bright prospect, Chipsbank has succeeded in obtaining investment from top venture capital companies such as Intel and Legend.

We offer an attractive remuneration package with comprehensive fringe benefits to the right candidatesincluding annual bonus and employee shareholding option program.

R&D Director
Responsibilities:
1. Good comprehension and vision of technical trend. Able to direct new products roadmap.
2. Develop and implement strategies and action plans for the R&D department.
3. Manage project scope, schedule and resources to achieve business objectives. Mentor and coach employees
4. Manage internal and external customer technical support activities.
5. Supports and participates in new product identification initiatives.
6. Evaluates new technologies for application to existing products and development into new products.
7. Coordinates the creation, development and improvement of department R&D work flow.
Qualifications:
1. Strong technical background, have hands-on working experience on software and hardware.
2. Good R&D management and coordinating skills.
3. Good creativity and problem-solving skills, experience of leading big project desired.
4. Must have good command of English.

ASIC Front End Design Engineer
1. Candidate should have over 2 years hands-on IC design experience and have at least been involved in two ASIC projects spanning from concept to Silicon. The ideal candidate should have:
Proven abilities to comprehend complex SOC
architectures and develop IC specifications or specification for the underlying components .
2. Very strong Verilog/VHDL RTL Design Skills. Ability to think hardware.
3. Synthesis and Static Timing analysis.
4. Pre-silicon Validation Experience at Module and Full Chip Level. Ancillary scripting skills like Perl/ Tcl-Tk/Awk highly desirable.
5. Knowledge of USB fundamentals, SD/MMC protocols, MCU architecture desirable.
6. Exposure to industry standard EDA tools like Modelsim/NC-Sim/VCS Simulators, Specman,Debussy, Signalscan, Synopsys-DC, Synopsys-PT, Build gates etc.
7. Ability to work indepently and as a team member.Strong Verbal and Written Communication Skills.

Back End Engineer
1. Candidates must have At least 2 years of experience in semiconductor/EDA with hands-on experience of ASIC implementation from RTL to GDSII.
2. Extensive knowledge of logic design, Verilog, timing, constraints, power and testability.
3. Direct experience with Cadence layout, parasitic extraction, and physical verification software (Virtuoso/XL, Assura, Dracula, Diva) will be needed.
4. Command of the Unix (Solaris) operating system is required.
5. Ability to work indepently and as a team member.Strong Verbal and Written Communication Skills .